SMD package field guide

Thirty-two common surface-mount packages: what each looks like, how big it really is and how much power it can handle, plus polarity marks, part codes and the rules of thumb every board designer needs. Written for CE351 alongside the Skyboard lectures. Each card’s picture is enlarged to fill the card; the lineup below and the dimensioned drawings show true size.

Every package in this guide drawn side by side at the same scale, from the 0.4 mm 01005 chip to the 16 mm TQFP-100
Every package at the same scale, top view. Grid squares are 5 mm.

Chip resistors & capacitors

Two metal end caps on a ceramic body. The name is the size code: imperial 0805 means 0.08 × 0.05 inch. Capacitors use the same sizes with a tan or grey body. Power ratings are standard thick-film resistor values at 70 °C ambient.

Rendered illustration of a 01005 package

01005Metric 0402

Size
0.4 × 0.2 mm
Leads
2 terminals
Power
1/32 W
Hand soldering
Reflow only
Typical use
Phones, wearables
Dimensioned top view, to scale01005 top view with overall dimensions and a scale bar

Rendered illustration of a 0201 package

0201Metric 0603

Size
0.6 × 0.3 mm
Leads
2 terminals
Power
1/20 W
Hand soldering
Reflow only
Typical use
Dense RF and mobile boards
Dimensioned top view, to scale0201 top view with overall dimensions and a scale bar

Rendered illustration of a 0402 package

0402Metric 1005

Size
1.0 × 0.5 mm
Leads
2 terminals
Power
1/16 W
Hand soldering
Hard
Typical use
Dense digital decoupling
Dimensioned top view, to scale0402 top view with overall dimensions and a scale bar

Rendered illustration of a 0603 package

0603Metric 1608

Size
1.6 × 0.8 mm
Leads
2 terminals
Power
1/10 W
Hand soldering
Moderate
Typical use
General default size
Dimensioned top view, to scale0603 top view with overall dimensions and a scale bar

Rendered illustration of a 0805 package

0805Metric 2012

Size
2.0 × 1.25 mm
Leads
2 terminals
Power
1/8 W
Hand soldering
Easy
Typical use
Hobby and class boards, Skyboard-style passives
Dimensioned top view, to scale0805 top view with overall dimensions and a scale bar

Rendered illustration of a 1206 package

1206Metric 3216

Size
3.2 × 1.6 mm
Leads
2 terminals
Power
1/4 W
Hand soldering
Easy
Typical use
Higher power or voltage
Dimensioned top view, to scale1206 top view with overall dimensions and a scale bar

Rendered illustration of a 1210 package

1210Metric 3225

Size
3.2 × 2.5 mm
Leads
2 terminals
Power
1/3–1/2 W
Hand soldering
Easy
Typical use
High-value ceramic capacitors
Dimensioned top view, to scale1210 top view with overall dimensions and a scale bar

Rendered illustration of a 1812 package

1812Metric 4532

Size
4.5 × 3.2 mm
Leads
2 terminals
Power
1/2–3/4 W
Hand soldering
Easy
Typical use
PTC fuses, high-voltage capacitors
Dimensioned top view, to scale1812 top view with overall dimensions and a scale bar

Rendered illustration of a 2010 package

2010Metric 5025

Size
5.0 × 2.5 mm
Leads
2 terminals
Power
3/4 W
Hand soldering
Easy
Typical use
Power resistors
Dimensioned top view, to scale2010 top view with overall dimensions and a scale bar

Rendered illustration of a 2512 package

2512Metric 6332

Size
6.3 × 3.2 mm
Leads
2 terminals
Power
1 W (2–3 W special series)
Hand soldering
Easy
Typical use
Current-sense shunts
Dimensioned top view, to scale2512 top view with overall dimensions and a scale bar

Diodes

Two-terminal packages with a band marking the cathode. SOD parts have small gull-wing leads; SMA, SMB and SMC have J-leads folded under the body and are rated by current and surge power.

Rendered illustration of a SOD-323 package

SOD-323SC-76

Size
1.7 × 1.25 mm body
Leads
2 leads
Power
0.2–0.3 W
Hand soldering
Moderate
Typical use
Small-signal and switching diodes
Dimensioned top view, to scaleSOD-323 top view with overall dimensions and a scale bar

Rendered illustration of a SOD-123 package

SOD-123

Size
2.7 × 1.6 mm body
Leads
2 leads
Power
0.4–0.5 W
Hand soldering
Easy
Typical use
General diodes, Zeners
Dimensioned top view, to scaleSOD-123 top view with overall dimensions and a scale bar

Rendered illustration of a SMA package

SMADO-214AC

Size
4.3 × 2.6 mm body
Leads
2 J-leads
Power
≈1 A diode; 400 W TVS pulse
Hand soldering
Easy
Typical use
Rectifiers, TVS
Dimensioned top view, to scaleSMA top view with overall dimensions and a scale bar

Rendered illustration of a SMB package

SMBDO-214AA

Size
4.3 × 3.6 mm body
Leads
2 J-leads
Power
2–3 A; 600 W TVS pulse
Hand soldering
Easy
Typical use
Schottky diodes, TVS
Dimensioned top view, to scaleSMB top view with overall dimensions and a scale bar

Rendered illustration of a SMC package

SMCDO-214AB

Size
6.9 × 5.9 mm body
Leads
2 J-leads
Power
3–5 A; 1500 W TVS pulse
Hand soldering
Easy
Typical use
Power TVS, rectifiers
Dimensioned top view, to scaleSMC top view with overall dimensions and a scale bar

Transistors & regulators

Three to six leads, with a metal tab on the larger packages. The tab is soldered to a copper area that spreads the heat, so the power figure depends on how much copper you give it.

Rendered illustration of a SC-70 package

SC-70SOT-323

Size
2.0 × 1.25 mm body
Leads
3–6 leads, 0.65 mm
Power
0.15–0.2 W
Hand soldering
Hard
Typical use
Tiny logic gates and transistors
Dimensioned top view, to scaleSC-70 top view with overall dimensions and a scale bar

Rendered illustration of a SOT-23 package

SOT-23TO-236

Size
2.9 × 1.3 mm body
Leads
3 leads, 0.95 mm
Power
0.2–0.35 W
Hand soldering
Moderate
Typical use
Small transistors (Skyboard Q1)
Dimensioned top view, to scaleSOT-23 top view with overall dimensions and a scale bar

Rendered illustration of a SOT-23-5 package

SOT-23-5SC-74A

Size
2.9 × 1.6 mm body
Leads
5 leads, 0.95 mm
Power
0.2–0.4 W
Hand soldering
Moderate
Typical use
Op-amps, LDOs (Skyboard OPA344, LP2985)
Dimensioned top view, to scaleSOT-23-5 top view with overall dimensions and a scale bar

Rendered illustration of a SOT-89 package

SOT-89

Size
4.5 × 2.5 mm body
Leads
3 leads, 1.5 mm
Power
0.5–1 W
Hand soldering
Easy
Typical use
Medium-power transistors, small regulators
Dimensioned top view, to scaleSOT-89 top view with overall dimensions and a scale bar

Rendered illustration of a SOT-223 package

SOT-223TO-261

Size
6.5 × 3.5 mm body
Leads
3 leads + tab, 2.3 mm
Power
1–2 W
Hand soldering
Easy
Typical use
LDOs such as the AMS1117
Dimensioned top view, to scaleSOT-223 top view with overall dimensions and a scale bar

Rendered illustration of a DPAK package

DPAKTO-252

Size
6.6 × 6.1 mm body
Leads
2 leads + tab, 4.57 mm
Power
2–3 W on a copper pad
Hand soldering
Easy
Typical use
MOSFETs, regulators
Dimensioned top view, to scaleDPAK top view with overall dimensions and a scale bar

Rendered illustration of a D²PAK package

D²PAKTO-263

Size
10.2 × 8.9 mm body
Leads
2–3 leads + tab, 5.08 mm
Power
3–5 W on a copper pad
Hand soldering
Easy (large iron)
Typical use
High-current MOSFETs and regulators
Dimensioned top view, to scaleD²PAK top view with overall dimensions and a scale bar

Integrated circuits

Leaded packages (SOIC, MSOP, TSSOP, QFP) can be inspected and reworked with an iron. Leadless QFN and BGA packages are smaller and run cooler, but need a stencil and reflow or hot air.

Rendered illustration of a SOIC-8 package

SOIC-8SO-8

Size
4.9 × 3.9 mm body, 6.0 mm with leads
Leads
8 leads, 1.27 mm
Power
0.5–1 W
Hand soldering
Easy
Typical use
Op-amps, audio amps, EEPROMs
Dimensioned top view, to scaleSOIC-8 top view with overall dimensions and a scale bar

Rendered illustration of a MSOP-8 package

MSOP-8VSSOP-8

Size
3.0 × 3.0 mm body
Leads
8 leads, 0.65 mm
Power
0.4–0.6 W
Hand soldering
Moderate
Typical use
Small op-amps (Skyboard LMV358)
Dimensioned top view, to scaleMSOP-8 top view with overall dimensions and a scale bar

Rendered illustration of a TSSOP-14 package

TSSOP-14

Size
5.0 × 4.4 mm body
Leads
14 leads, 0.65 mm
Power
0.5–1 W
Hand soldering
Moderate
Typical use
Logic (Skyboard 74LVC125)
Dimensioned top view, to scaleTSSOP-14 top view with overall dimensions and a scale bar

Rendered illustration of a QFN-32 package

QFN-325 × 5 mm

Size
5.0 × 5.0 mm
Leads
32 pads, 0.5 mm, exposed pad
Power
1–3 W with thermal vias
Hand soldering
Hard (hot air)
Typical use
MCUs (Skyboard ATmega16U2)
Dimensioned bottom view, to scaleQFN-32 bottom view with overall dimensions and a scale bar

Rendered illustration of a TQFP-100 package

TQFP-10014 × 14 mm

Size
14 × 14 mm body, 16 mm with leads
Leads
100 leads, 0.5 mm
Power
0.7–1.5 W
Hand soldering
Moderate (drag solder)
Typical use
MCUs (Skyboard ATmega2560)
Dimensioned top view, to scaleTQFP-100 top view with overall dimensions and a scale bar

Rendered illustration of a BGA (example) package

BGA (example)10 × 10 mm, 0.8 mm pitch

Size
10 × 10 mm (sizes vary widely)
Leads
144 balls, 0.8 mm
Power
1 W to tens of W with heatsink
Hand soldering
Reflow only
Typical use
FPGAs, processors, memory
Dimensioned bottom view, to scaleBGA (example) bottom view with overall dimensions and a scale bar

Shown upside down so the solder balls are visible.

Tantalum & polymer capacitors

Polarised capacitors in letter-coded cases. The band marks the positive (anode) end, the opposite of a diode band. They are limited by voltage and ripple current rather than a power rating.

Rendered illustration of a Case A package

Case AEIA 3216

Size
3.2 × 1.6 mm
Leads
2 terminals, polarised
Power
Rated by voltage and ripple current
Hand soldering
Easy
Typical use
1–10 µF
Dimensioned top view, to scaleCase A top view with overall dimensions and a scale bar

Rendered illustration of a Case B package

Case BEIA 3528

Size
3.5 × 2.8 mm
Leads
2 terminals, polarised
Power
Rated by voltage and ripple current
Hand soldering
Easy
Typical use
10–47 µF
Dimensioned top view, to scaleCase B top view with overall dimensions and a scale bar

Rendered illustration of a Case C package

Case CEIA 6032

Size
6.0 × 3.2 mm
Leads
2 terminals, polarised
Power
Rated by voltage and ripple current
Hand soldering
Easy
Typical use
22–100 µF
Dimensioned top view, to scaleCase C top view with overall dimensions and a scale bar

Rendered illustration of a Case D package

Case DEIA 7343

Size
7.3 × 4.3 mm
Leads
2 terminals, polarised
Power
Rated by voltage and ripple current
Hand soldering
Easy
Typical use
47–470 µF bulk
Dimensioned top view, to scaleCase D top view with overall dimensions and a scale bar

Polarity and pin 1

Most first-board failures are a part soldered the wrong way round. Learn these marks, put matching marks in your silkscreen, and check them against the datasheet before ordering.

Chip LED top and bottom views with cathode and anode marked

Chip LEDs

Look for a green line, dot or notch on the top, or a diode arrow on the bottom; the arrow points to the cathode. Conventions differ between makers, so confirm with the datasheet or a multimeter’s diode mode: the LED glows faintly when the red probe is on the anode.

Through-hole LED with cathode flat, short lead and anvil marked

Through-hole LEDs

The anode has the longer lead. The cathode side has a flat on the rim and usually the larger anvil inside. Once the leads are trimmed, the flat is the mark that remains.

5050 RGB LED with pin 1 corner

RGB and multi-pin LEDs

A cut corner, dot or triangle marks pin 1. Common-anode and common-cathode versions look identical, and colour-to-pin order varies, so read the pinout table every time.

Diode band is cathode, tantalum band is anode

Diode vs tantalum band

The classic trap: a diode band marks the cathode (−), but a tantalum capacitor band marks the anode (+). A reversed tantalum can fail short and catch fire.

SMD electrolytic polarity marks

Aluminium electrolytic cans

The black stripe on top marks negative. On the plastic base, the chamfered corners are on the positive side. Footprints usually copy that outline in silkscreen.

SOIC and QFP pin 1 marks and counting direction

IC pin 1

Pin 1 is next to the dot, dimple or bevelled edge. Pins then count counter-clockwise viewed from the top. Large dots can be mould marks: if there are two, the smaller one is usually pin 1.

SOT-23 and SOT-23-5 pin numbers

SOT-23 numbering

Pin numbering is fixed, but the function is not: one SOT-23 transistor may be B-E-C and another G-S-D in a different order. Never assume a pinout from the package.

Reading part markings

Small parts carry codes instead of values. Many ceramic capacitors carry no marking at all, so keep them in labelled tape or bags.

MarkingPartHow to read itValue
103Resistor, 3-digit10 × 10³10 kΩ (5%)
472Resistor, 3-digit47 × 10²4.7 kΩ
4R7 · R47ResistorR is the decimal point4.7 Ω · 0.47 Ω
1002Resistor, 4-digit100 × 10²10.0 kΩ (1%)
01CResistor, EIA-96Code 01 = 100, letter C = × 10010.0 kΩ (1%)
0 or 000Zero-ohm linkA jumper in resistor form≈ 0 Ω
107 · 6VTantalum capacitor10 × 10⁷ pF, then rated voltage100 µF, 6.3 V
47 · 25VElectrolytic canValue printed directly47 µF, 25 V
100 · 4R7InductorCode in µH10 µH · 4.7 µH
Ceramic dielectricTemperature rangeChange over temperatureUse it for
C0G / NP0−55 to +125 °C±30 ppm/°C, no voltage lossCrystal load caps, filters, timing (pF to ~nF)
X7R−55 to +125 °C±15%General decoupling
X5R−55 to +85 °C±15%High-value decoupling in small cases
Y5V / Z5U−30 to +85 °C+22 / −82%Avoid in new designs

Ceramic capacitors shrink under voltage

Illustrative chart: C0G keeps full capacitance, X7R, X5R and Y5V lose capacitance as DC voltage rises

Class 2 ceramics (X7R, X5R, Y5V) lose capacitance as DC voltage is applied. A 10 µF, 6.3 V, 0603 X5R part on a 5 V rail may deliver only a third of its label value.

Use a higher voltage rating or a larger case to keep more of it, and check the manufacturer’s DC-bias curve for the exact part. C0G parts do not have this effect, which is why they are used for crystals and filters.

Rules of thumb everyone should know

Every LED needs a current limit

R = (Vsupply − Vf) / If

Red from 5 V at 10 mA: (5 − 2.0) / 0.01 = 300 Ω, so use 330 Ω. Give each LED its own resistor rather than sharing one across parallel LEDs.

ColourTypical Vf
Infrared1.2–1.5 V
Red1.8–2.2 V
Yellow / orange2.0–2.2 V
Green (InGaN), blue, white2.8–3.4 V

Derate capacitors

Tantalum (MnO₂): use a part rated about twice the working voltage, e.g. 10 V on a 5 V rail, and limit inrush. Polymer: about 20% margin. Electrolytic: life roughly halves for every 10 °C hotter, so keep them away from regulators and power resistors.

Crystal load capacitors

C1 = C2 ≈ 2 × (CL − Cstray)

CL is on the crystal datasheet; stray capacitance is typically 2–5 pF. A 15 pF crystal with 4 pF stray needs ≈ 22 pF, the value on the Skyboard 16U2 crystal. Use C0G parts.

Static kills quietly

MOSFETs, CMOS ICs and LEDs can be damaged by a discharge you cannot feel. Use a wrist strap and mat, keep parts in their antistatic bags until placement, and touch ground before handling a board.

Moisture-sensitive parts

Plastic packages absorb moisture. Check the MSL rating on the reel bag: if a level 3 part has been out longer than its floor life (168 hours), bake it before reflow, or it can crack inside (“popcorning”).

Avoid tombstoning

Small passives can stand on one end during reflow when one pad heats faster. Keep both pads the same size, connect them with equal trace widths, and use thermal relief on pour connections.

Know your fuse

A PTC’s hold current is what it carries forever; trip current is usually about double, and tripping takes time. Hold current falls as the board heats up. Skyboard’s F1 holds 500 mA at room temperature.

Check before you order

Print the layout 1:1 and lay real parts on it. Check pin 1 and polarity marks against the datasheet, view the 3D model, and make sure the silkscreen marks stay visible after the part is placed.

Where the power limits come from

P = (TJ,max − TA) / θJA

Transistor and IC packages do not have a fixed power rating. The chip can run up to its maximum junction temperature, usually 125–150 °C, and θJA (°C per watt, from the datasheet) says how fast heat escapes to the air.

Example: a SOT-23 at about 350 °C/W on minimum pads, 150 °C junction, 25 °C room: (150 − 25) / 350 ≈ 0.36 W.

Copper is the heatsink

Packages with a tab or exposed pad (SOT-223, DPAK, QFN) move most of their heat into the board. A larger copper pour and thermal vias to the other layer can lower θJA by half or more, which is how a DPAK reaches several watts.

Chip resistors are rated at 70 °C ambient and derate linearly to zero at about 155 °C. Keep at least a 2× margin in practice.

Quick reference

PackageAlso calledSizeLeads / pitchTypical powerHand soldering
01005Metric 04020.4 × 0.2 mm2 terminals1/32 WReflow only
0201Metric 06030.6 × 0.3 mm2 terminals1/20 WReflow only
0402Metric 10051.0 × 0.5 mm2 terminals1/16 WHard
0603Metric 16081.6 × 0.8 mm2 terminals1/10 WModerate
0805Metric 20122.0 × 1.25 mm2 terminals1/8 WEasy
1206Metric 32163.2 × 1.6 mm2 terminals1/4 WEasy
1210Metric 32253.2 × 2.5 mm2 terminals1/3–1/2 WEasy
1812Metric 45324.5 × 3.2 mm2 terminals1/2–3/4 WEasy
2010Metric 50255.0 × 2.5 mm2 terminals3/4 WEasy
2512Metric 63326.3 × 3.2 mm2 terminals1 W (2–3 W special series)Easy
SOD-323SC-761.7 × 1.25 mm body2 leads0.2–0.3 WModerate
SOD-1232.7 × 1.6 mm body2 leads0.4–0.5 WEasy
SMADO-214AC4.3 × 2.6 mm body2 J-leads≈1 A diode; 400 W TVS pulseEasy
SMBDO-214AA4.3 × 3.6 mm body2 J-leads2–3 A; 600 W TVS pulseEasy
SMCDO-214AB6.9 × 5.9 mm body2 J-leads3–5 A; 1500 W TVS pulseEasy
SC-70SOT-3232.0 × 1.25 mm body3–6 leads, 0.65 mm0.15–0.2 WHard
SOT-23TO-2362.9 × 1.3 mm body3 leads, 0.95 mm0.2–0.35 WModerate
SOT-23-5SC-74A2.9 × 1.6 mm body5 leads, 0.95 mm0.2–0.4 WModerate
SOT-894.5 × 2.5 mm body3 leads, 1.5 mm0.5–1 WEasy
SOT-223TO-2616.5 × 3.5 mm body3 leads + tab, 2.3 mm1–2 WEasy
DPAKTO-2526.6 × 6.1 mm body2 leads + tab, 4.57 mm2–3 W on a copper padEasy
D²PAKTO-26310.2 × 8.9 mm body2–3 leads + tab, 5.08 mm3–5 W on a copper padEasy (large iron)
SOIC-8SO-84.9 × 3.9 mm body, 6.0 mm with leads8 leads, 1.27 mm0.5–1 WEasy
MSOP-8VSSOP-83.0 × 3.0 mm body8 leads, 0.65 mm0.4–0.6 WModerate
TSSOP-145.0 × 4.4 mm body14 leads, 0.65 mm0.5–1 WModerate
QFN-325 × 5 mm5.0 × 5.0 mm32 pads, 0.5 mm, exposed pad1–3 W with thermal viasHard (hot air)
TQFP-10014 × 14 mm14 × 14 mm body, 16 mm with leads100 leads, 0.5 mm0.7–1.5 WModerate (drag solder)
BGA (example)10 × 10 mm, 0.8 mm pitch10 × 10 mm (sizes vary widely)144 balls, 0.8 mm1 W to tens of W with heatsinkReflow only
Case AEIA 32163.2 × 1.6 mm2 terminals, polarisedRated by voltage and ripple currentEasy
Case BEIA 35283.5 × 2.8 mm2 terminals, polarisedRated by voltage and ripple currentEasy
Case CEIA 60326.0 × 3.2 mm2 terminals, polarisedRated by voltage and ripple currentEasy
Case DEIA 73437.3 × 4.3 mm2 terminals, polarisedRated by voltage and ripple currentEasy