CE 351 Spring 2023
Lab 6 Photo PID
Name: Mason
Brady
Email:
mrbrady1@fortlewis.edu
Photo PID
Introduction:
Soldering Pulse Ox PCB
Materials:
PCB Soldering
Methods: The PCB was soldered
using the reflux hot plate. Flux was applied followed by a small amount
of solder paste on each pad. The hot plate was brought to 150 degrees C
and allowed to sit for 2 minutesbefore ramping to 220. After the board
reached 220 the hot plate was turned off and the pcb was gently moved
to the solder mat to cool(The hot plate takes ages to cool). The final
board can be seen below:
I
was unable to get the board to function properly, I think the chip was
not getting programmed for some reason. Every component is receiving
power and the pulse ox is outputting a signal so I think it is an
atmega programming issue. I have had issues programming through RX and
TX in the past.