All the
relevant components were gathered and a schematic was hand-drawn in
order to make soldering and component placement more efficient. The
following process was followed for the soldering of each component; the
component was placed on the board, a small amount flux was added to the
joints that will be soldered, the joint was heated up, and the solder
wire was touched to the joint. Once all of the components were soldered
to the board, a small amount of solder was added to the joints where a
jumper wire will be attatched. Jumper wires were then soldered to the
relevant components. The circuit was then testsed using the power
supply (figure 1). A SMT (surface mount component) resistor was then
layed on top of a PCB and a small amount of lux was applied. A small
amount of solder was then applied to the resistor (figure 2). A section
of solder-wick was then placed on the resistor and the soldering iron
was pressed to the solder wick immediately above the resisotor. The
wick attracts the solder and the resistor is easily removed from the
board (figure 3).