The experiment protocol is briefly described here. Some of the figures are attached.

It is fabricated in the cleanroom facility of Nevada Nanotechnology Center at University of Nevada, Las Vegas. The fabrication reagents includes Schott Boro Float glass substrate with Chrome coated (100 nm) microfluidic blank slides (with positive photoresist coated, Telic, Valencia, CA, USA), photoresist developer RD6 (Futurrex, INC., Franklin, NJ, USA), Chromium etchant (Sigma-Aldrich, Co., MO, USA) and photoresist remover (Microposit Remover 1165, Rohm and Haas Electronic Materials LLC, MA, USA). Open source integrated circuit (IC) layout tools Electric VLSI is used to pattern the mask of the electrode array. GDSII output files from Electric VLSI were sent to Infinite Graphics INC. (MN, USA) for plotting (25,000 dpi resolution) on a plastic photolithography film.
The substrates are covered by the patterned photomask and exposed to a UV light source for 45 seconds and then developed for 1 min in RD6. Substrates are then immersed in the Chromium etchant for about 15-20 seconds. Then the substrates are washed by DI water and dried out using nitrogen gas. The remaining photoresist is removed by Microposit Remover 1165. If the remover doesn't remove all of the photoresist Kimwipes (Uline, WI, USA) (wetted by Microposit Remover or DI water) can be used to remove the remaining photoresist.